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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis

ISBN 13: 9783319204802

Format: Hardcover (364 pages)
Publisher: Springer
Published: 23 May 2016

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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems

by Ibrahim (Abe) M. Elfadel,Gerhard Fettweis

ISBN 13: 9783319793054

Format: Paperback (364 pages)
Publisher: Springer
Published: 06 Jun 2018

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